Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURED PRODUCT MANUFACTURING METHOD, LAMINATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/008049
Kind Code:
A1
Abstract:
Provided are: a cured product manufacturing method whereby a cured product having excellent adhesion with metal can be obtained; a laminate manufacturing method that uses the cured product manufacturing method; and a semiconductor device manufacturing method. Provided are: a resin composition whereby a cured product having excellent adhesion with metal can be obtained; a cured product obtained by curing the resin composition; a laminate that includes the cured project; and a semiconductor device. This cured product manufacturing method includes a film forming step and a heating step for heating the film at a heating temperature of 180°C or lower. The film after the heating step is raised in temperature from 25°C to 260°C at a speed of 10°C/minute, is maintained at 260°C for 15 minutes, and the mass loss ratio when the temperature is raised from 260°C to 300°C at a speed of 10°C/minute is 15% or lower. The cyclization rate of a cyclized resin obtained from a precursor of the cyclized resin in the obtained cured product is 95% or higher.

More Like This:
JP7333383Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device
JP2005134743HARDENING TYPE PHOTORESIST AND METHOD FOR FORMING IMAGE BY USING THE SAME
JP7078744Resin composition, cured film, laminate, method for manufacturing cured film, and semiconductor device
Inventors:
NOZAKI ATSUYASU (JP)
TAKASHIMA MISAKI (JP)
Application Number:
PCT/JP2022/025647
Publication Date:
February 02, 2023
Filing Date:
June 28, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/037; C08G73/10; G03F7/004; G03F7/027; G03F7/028; G03F7/20; G03F7/32
Domestic Patent References:
WO2020071437A12020-04-09
WO2018151195A12018-08-23
WO2016194769A12016-12-08
Foreign References:
JPH0683049A1994-03-25
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: HEAT CYCLE SYSTEM, IN-WHEEL MOTOR, AND VEHICLE

Next Patent: DISPLAY DEVICE AND ELECTRONIC EQUIPMENT