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Patent Searching and Data


Title:
DE-BONDING LEVELING DEVICE AND DE-BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/019276
Kind Code:
A1
Abstract:
A de-bonding leveling device and a de-bonding method, for use in implementing the leveling in a de-bonding process between a first object and a second object. The first object and the second object are respectively fixed by a first fixing plate (11) and a second fixing plate (21). The device comprises a mounting plate (30), a connecting rod assembly (40), and at least three elastic assemblies (70). The mounting plate (30) is disposed on the outer side of one of the first fixing plate (11) and the second fixing plate (21). The connecting rod assembly (40) is fixed to the central position of the mounting plate (30). The connecting rod assembly (40) is connected to one fixing plate by means of a movable pair (50) and a spherical pair (60) that are sequentially connected. The elastic assemblies (70) are disposed between the mounting plate (30) and one fixing plate, and are respectively connected to the mounting plate (30) and the fixing plate. By using the combination of the movable pair and the spherical pair, a leveling object can adapt to dynamic changes of a reference object, and the elastic assemblies enable the leveling object to be leveled according to the real-time attitude of the reference object. The structure is simple, the layout is proper, and actual applications are easy, so that the de-bonding leveling device has better use value in a dynamical leveling working condition that does not need active control.

Inventors:
GAO YUYING (CN)
WEI WEI (CN)
Application Number:
PCT/CN2017/094765
Publication Date:
February 01, 2018
Filing Date:
July 27, 2017
Export Citation:
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Assignee:
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD (CN)
International Classes:
H01L21/68
Foreign References:
CN105047589A2015-11-11
CN205380975U2016-07-13
JP2000228463A2000-08-15
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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