Title:
DIGITAL MICROFLUIDIC SUBSTRATE AND DIGITAL MICROFLUIDIC CHIP
Document Type and Number:
WIPO Patent Application WO/2020/211547
Kind Code:
A1
Abstract:
A digital microfluidic substrate and a digital microfluidic chip comprising same. The digital microfluidic substrate comprises: a first substrate (21); a driving transistor (22) disposed on the first substrate (21); a metal layer comprising a source (224) and a drain (225) of the driving transistor (22) and a first driving electrode (23) electrically connected to one of the source (224) and the drain (225); an insulating layer (24) covering the driving transistor (22) and the first driving electrode (23); a second driving electrode (27) electrically connected to the first driving electrode (23) by means of a via hole penetrating the insulating layer (24); and a first ground electrode (25) disposed in the insulating layer (24) and located between the metal layer and the second driving electrode (27).
Inventors:
PANG FENGCHUN (CN)
CAI PEIZHI (CN)
CAI PEIZHI (CN)
Application Number:
PCT/CN2020/077147
Publication Date:
October 22, 2020
Filing Date:
February 28, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE SENSOR TECH CO LTD (CN)
BEIJING BOE SENSOR TECH CO LTD (CN)
International Classes:
B01L3/00; G02F1/1343; H01L27/146
Foreign References:
| CN209791582U | 2019-12-17 | |||
| CN103474434A | 2013-12-25 | |||
| CN104846400A | 2015-08-19 | |||
| CN106154655A | 2016-11-23 | |||
| CN105487717A | 2016-04-13 | |||
| CN109420532A | 2019-03-05 | |||
| US20150287760A1 | 2015-10-08 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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