ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME

Title:

ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2017/013945

Kind Code:

A1

Abstract:

Provided is an elastic wave device, whereby a strain of an IDT electrode can be reduced at the time when elastic waves are excited, and excellent IMD characteristics can be achieved. An elastic wave device 1 is provided with: a piezoelectric substrate 3 having an electrode forming surface 3a; and an IDT electrode 2 that is provided on the electrode forming surface 3a. The IDT electrode 2 has: an adhesion layer 4 that is provided on the electrode forming surface 3a; and a main electrode layer 6 that is provided on the adhesion layer 4. The adhesion layer 4 has first and second layers 4A, 4B. The first and second layers 4A, 4B have first and second side surfaces 4Ac, 4Bc, respectively. At least respective parts of the first and second side surfaces 4Ac, 4Bc, and the normal line direction Z of the electrode forming surface 3a form tilt angles θ1, θ2 of the first and second side surfaces 4Ac, 4Bc such that the area of a second layer 4B surface adhered to the main electrode layer 6 is smaller than the area of a first layer 4A surface adhered to the piezoelectric substrate 3. The tilt angle θ2 of the second side surface 4Bc is smaller than the tilt angle θ1 of the first side surface 4Ac.

Inventors:

KIKUCHI TAKU (JP)
KONOMA CHIHIRO (JP)
TSUBOKAWA MASASHI (JP)
NAKAGAWA RYO (JP)

Application Number:

PCT/JP2016/066248

Publication Date:

January 26, 2017

Filing Date:

June 01, 2016

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H03H9/145; H03H3/08

Domestic Patent References:

WO2007034832A1	2007-03-29
WO2003058813A1	2003-07-17

Foreign References:

JP2014158138A	2014-08-28
JPH0522067A	1993-01-29