Title:
ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/190244
Kind Code:
A1
Abstract:
To provide an electroconductive material with which it is possible to efficiently dispose solder in electroconductive particles on an electrode even when the electrode width is small, and improve conduction reliability. An electroconductive material according to the present invention contains, on the outside surface portion of an electroconductive part, a plurality of electroconductive particles having solder, a heat-curable compound, a thiol curing agent, and an amine curing agent.
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Inventors:
KUBOTA TAKASHI (JP)
TAKAHASHI HIDEYUKI (JP)
NISHIOKA KEIZO (JP)
TAKAHASHI HIDEYUKI (JP)
NISHIOKA KEIZO (JP)
Application Number:
PCT/JP2016/065014
Publication Date:
December 01, 2016
Filing Date:
May 20, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; H01B1/00; H01B5/16; H01R11/01
Domestic Patent References:
| WO2013125517A1 | 2013-08-29 | |||
| WO2014112541A1 | 2014-07-24 | |||
| WO2013080708A1 | 2013-06-06 |
Foreign References:
| JP2015004056A | 2015-01-08 | |||
| JP2015005502A | 2015-01-08 | |||
| JP2001288245A | 2001-10-16 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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