Title:
ELECTRONIC COMPONENT MOUNTING BOARD AND LIGHT EMISSION DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/047702
Kind Code:
A1
Abstract:
Provided is an electronic component mounting board that has an excellent migration resistance and that can maintain a high thermal conductivity and a high insulating property for a long time. An electronic component mounting board 10 comprises: a metallic board 11 made of aluminum or of an aluminum-based alloy; alumite layers 12 each of which is formed on the metallic board 11 and each of which has mesh-like crevices 22 on an upper surface 21; and ceramic layers 13 each of which is formed on the respective alumite layer 12 and some parts of each of which extend into the crevices 22.
Inventors:
ITOU SEIICHIROU (JP)
TOJO TETSUYA (JP)
OYAMADA TAKESHI (JP)
KONISHI YOSHITADA (JP)
HORINOUCHI NAOKI (JP)
TOJO TETSUYA (JP)
OYAMADA TAKESHI (JP)
KONISHI YOSHITADA (JP)
HORINOUCHI NAOKI (JP)
Application Number:
PCT/JP2015/076965
Publication Date:
March 31, 2016
Filing Date:
September 24, 2015
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/05; H01L33/48
Foreign References:
| JP2014116351A | 2014-06-26 | |||
| JPS6075462U | 1985-05-27 | |||
| JPS63137157A | 1988-06-09 | |||
| JP2015137401A | 2015-07-30 |
Other References:
See also references of EP 3200571A4
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