Title:
ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/020480
Kind Code:
A1
Abstract:
An electronic component mounting package comprising: a wiring board having a first surface and a wiring pattern positioned upon the first surface; a base having a second surface and a through-hole opening to the second surface; a first insulating member having a first end positioned in the through-hole and positioned on the second surface side; a signal wire that penetrates the first insulating member and has a second end positioned on the second surface side; and a conductive joining material that joins the wiring pattern and the second end of the signal wire. The wiring board is arranged having a gap between the wiring board and the first end of the first insulating member. The conductive joining material has a first region positioned in at least part of the gap.
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Inventors:
ONDA TOMOHARU (JP)
Application Number:
PCT/JP2020/029162
Publication Date:
February 04, 2021
Filing Date:
July 29, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H01L23/36; H01L31/02; H01S5/022
Domestic Patent References:
| WO2019082602A1 | 2019-05-02 |
Foreign References:
| JP2009170865A | 2009-07-30 | |||
| JP2004127963A | 2004-04-22 | |||
| JP2000091461A | 2000-03-31 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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