Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/264634
Kind Code:
A1
Abstract:
This disclosure provides an electronic component (10) for which the peeling of an insulation film (50) from a base body (20) is prevented. The electronic component (10) comprises a base body (20) and an insulation film (50) that covers an outer surface (21) of the base body (20). The insulation film (50) includes a mixed layer (51) and a glass layer (56). The mixed layer (51) includes glass (52) and a powdered material (53). The glass layer (56) includes glass (57) and contains the powdered material (53) at a ratio smaller than that of the mixed layer (51). The mixed layer (51) is located, as seen from the glass layer (56), on the base body (20) side.
More Like This:
Inventors:
OOSHIMA TOMOYA (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
KUBOTA HIRONOBU (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
KUBOTA HIRONOBU (JP)
Application Number:
PCT/JP2022/015950
Publication Date:
December 22, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C7/02; H01C7/04; H01F27/29; H01F27/32; H01G4/30
Foreign References:
| JP2020036002A | 2020-03-05 | |||
| JPH10106809A | 1998-04-24 | |||
| JP2021089924A | 2021-06-10 |
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
Download PDF: