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Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/264635
Kind Code:
A1
Abstract:
Provided is an electronic component (10) in which the development of a crack (26) in an element body (20) is suppressed. The electronic component (10) comprises an element body (20) and an insulating film (50) covering an outer surface (21) of the element body (20). The outer surface (21) of the element body (20) has a planar side surface (22C). The element body (20) has a crack (26) opening on the outer surface (21). In a cross section (CS) orthogonal to the side surface (22C), the crack (26) has a first portion (26A). The first portion (26A) extends from the opening (27) transverse to an orthogonal axis orthogonal to the side surface (22C). A part of the insulating film (50) is located in the inner space of the first portion (26A).

Inventors:
OOSHIMA TOMOYA (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
KUBOTA HIRONOBU (JP)
Application Number:
PCT/JP2022/015951
Publication Date:
December 22, 2022
Filing Date:
March 30, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C7/02; H01C7/04; H01F27/29; H01F27/32; H01G4/30
Foreign References:
JP2020036002A2020-03-05
JPH10106809A1998-04-24
JP2021089924A2021-06-10
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
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