Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/084879
Kind Code:
A1
Abstract:
In the present invention, a first internal electrode (41) is positioned inside an element body (20). A glass film (50) covers an outer surface (21) of the element body (20). A first base electrode (61A) is electrically connected to the first internal electrode (41) and also partially covers the glass film (50). A first metal layer (61B) covers the first base electrode (61A). A location, on the glass film (50), that is not covered by the first base electrode (61A) and that is separated by more than 10 μm from an outer edge of the first base electrode (61A) is defined as a non-covered location (AU). A location, of the glass film (50), that is not covered by the first base electrode (61A) and that is not separated by more than 10 μm from the outer edge of the first base electrode (61A) is defined as a boundary location (AB). In this case, the thickness of the boundary location (AB) is greater than that of the non-covered location (AU).

Inventors:
OOSHIMA TOMOYA (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
NAKANO MITSURU (JP)
Application Number:
PCT/JP2022/032713
Publication Date:
May 19, 2023
Filing Date:
August 31, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30; H01C7/04; H01F27/29
Foreign References:
JP2017204565A2017-11-16
JP2002170736A2002-06-14
JP2013197586A2013-09-30
US20200105478A12020-04-02
JP2022085818A2022-06-08
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
Download PDF: