ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE

Title:

ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2020/213900

Kind Code:

A1

Abstract:

Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.

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Inventors:

SEO SEUNGHAN (KR)
LEE JONGPILL (KR)
JANG CHANGWON (KR)

Application Number:

PCT/KR2020/004958

Publication Date:

October 22, 2020

Filing Date:

April 13, 2020

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H04M1/02; H01Q1/38; H05K7/20; H05K9/00

Foreign References:

US20150123860A1	2015-05-07
US20170062899A1	2017-03-02
US20180089551A1	2018-03-29
US20180035528A1	2018-02-01
US20170062906A1	2017-03-02

Other References: