Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/026319
Kind Code:
A1
Abstract:
This electronic device is provided with: a resin molding (10); and a conductive cable (31b) including an electric wire (32b). One end portion (35b) of the conductive cable (31b) is embedded in the resin molding (10). The surface of the resin molding (10) exposes an end surface (34b) on the side of the one end portion (35b) of the conductive cable (31b) and includes a surface (11) which is continuous to the end surface (34b). The electronic device is further provided with wires (40f, 40i) formed on the end surface (34b) and the surface (11) so as to be connected to the electric wire (32b) in the end surface (34b).
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Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2018/005489
Publication Date:
February 07, 2019
Filing Date:
February 16, 2018
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H05K3/00; H05K3/32
Foreign References:
| JP2009295945A | 2009-12-17 | |||
| JP2010272756A | 2010-12-02 | |||
| JP2013207141A | 2013-10-07 | |||
| US20080067637A1 | 2008-03-20 | |||
| JP2006093378A | 2006-04-06 |
Other References:
See also references of EP 3664587A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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