Title:
ELECTRONIC DEVICE PACKAGE, METHOD OF MANUFACTURING ELECTRONIC DEVICE PACKAGE, AND TAPE FOR ELECTRONIC DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/168824
Kind Code:
A1
Abstract:
Provided are an electronic device package, a method of manufacturing an electronic device package, and a tape for an electronic device package with which it is possible to suppress a deterioration in heat dissipation characteristics and a deterioration in reliability caused by an adhesive layer or a metal layer peeling as a result of an external force. This electronic device package includes a board, an electronic device connected to the board in such a way that a first surface thereof faces the board, an adhesive layer provided on a second surface of the electronic device, on the opposite side to the first surface, and a metal layer caused to adhere to the second surface of the electronic device by means of the adhesive layer, characterized in that: planar size of metal layer ≤ planar size of adhesive layer < planar size of second surface of electronic device.
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Inventors:
SUGIYAMA JIROU (JP)
AOYAMA MASAMI (JP)
SANO TORU (JP)
AOYAMA MASAMI (JP)
SANO TORU (JP)
Application Number:
PCT/JP2016/084559
Publication Date:
October 05, 2017
Filing Date:
November 22, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L23/40; H01L23/36
Foreign References:
| JP2002118198A | 2002-04-19 | |||
| US20030112604A1 | 2003-06-19 | |||
| US20120306067A1 | 2012-12-06 | |||
| JP2012015225A | 2012-01-19 | |||
| US20080251910A1 | 2008-10-16 | |||
| US20030201544A1 | 2003-10-30 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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