ELECTRONIC DEVICE PACKAGE TAPE

WIPO Patent Application WO/2017/168820

A1

Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhibit the formation of voids in the bonding adhesive layer during flip-chip connection. An electronic device package tape of the present invention is characterized by comprising: an adhesive tape that has a base film and a pressure-sensitive adhesive layer; a metal layer that is laminated on the side of the pressure-sensitive adhesive layer opposite the base film; and a bonding adhesive layer that is laminated on the side of the metal layer opposite the pressure-sensitive adhesive layer and is for bonding the metal layer to the rear face of an electronic device. The electronic device package tape is further characterized in that the storage elastic modulus at 25ºC of the bonding adhesive layer after being heated at 100ºC for three hours does not exceed 10 GPa, and the cured proportion of the bonding adhesive layer upon being heated at 100ºC for three hours is 10-100%.

JP5429921	Semiconductor element manufacturing equipment
JPS54128278	RESIN-SEALED SEMICONDUCTOR DEVICE AND ITS PACKAGING METHOD
JP3202716	TRAY FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND LEAD CORRECTING METHOD WITH THE TRAY

SANO TORU (JP)
SUGIYAMA JIROU (JP)
AOYAMA MASAMI (JP)
ISHIGURO KUNIHIKO (JP)

PCT/JP2016/083696

October 05, 2017

November 14, 2016

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FURUKAWA ELECTRIC CO LTD (JP)

H01L23/00; C09J7/20; C09J11/04; C09J11/08; C09J133/00; C09J163/00; C09J201/00; H01L21/301

JP2012033626A	2012-02-16
JP2012033555A	2012-02-16

MATSUSHITA, Makoto et al. (JP)

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