Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/167049
Kind Code:
A1
Abstract:
Provided is an electronic device in which molten solder does not contact a sealing material, and there is no damage to the sealing function. To this end, this electronic device has: an insulating base 10 mounted to a printed circuit board 51; a common planar terminal 20 that is provided continuously from the outside surface of the insulating base 10 to the floor-surface edge section thereof, and conducts between the outside surface of the insulating base 10 and the floor-surface edge section thereof; a cover 40 which is fitted onto the insulating base 10, and covers the common planar terminal 20; and a sealing material 50 for sealing the gap between the outside surface of the insulating base 10 and the inner-circumferential surface of the cover 40. A solder pool section 23 is formed in a location surrounded by the printed circuit board 51 and the common planar terminal 20 in the floor-surface edge section of the insulating base 10.
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Inventors:
SHIMODA SEIKI (JP)
ABE MASAAKI (JP)
ABE MASAAKI (JP)
Application Number:
PCT/JP2016/057148
Publication Date:
October 20, 2016
Filing Date:
March 08, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H9/02; H01H45/04
Foreign References:
| JPH08255544A | 1996-10-01 | |||
| JP2002076161A | 2002-03-15 | |||
| JP2004158349A | 2004-06-03 | |||
| JP2014179947A | 2014-09-25 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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