Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/199647
Kind Code:
A1
Abstract:
An electronic device is provided with, an electronic component (12), a sealing resin body (11) for sealing the electronic component, and a plurality of conductive members electronically connecting to the electronic component inside of the sealing resin body, having a portion thereof exposed to the outside from the sealing resin body, and having electric potential differing from each other. The conductive members include external connection terminals (14, 22, 23, 24, 25) extending from the inside of the sealing resin body to the outside. The surfaces of the external connection terminals have: a connection part (40a) for electrically connecting with the electronic component; a high adhesion part (43) having a high adhesive force with the sealing resin body for a part, which is the part other than the connection part, covered by the sealing resin body; and a low adhesion part (44), which has an adhesive force with the sealing resin body that is lower than that of the high adhesion part. The low adhesion part is provided in the direction the external connection terminals extend from an outer peripheral end of the sealing resin body on at least one of a connection surface (40) that includes the connection part and a back surface (41) which is opposite to the connection surface in the direction of plate thickness.
Inventors:
FUJITA HIROHITO (JP)
Application Number:
PCT/JP2017/014897
Publication Date:
November 23, 2017
Filing Date:
April 12, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/28; H01L23/48
Foreign References:
| JP2006179655A | 2006-07-06 | |||
| JPS58144855U | 1983-09-29 | |||
| JPS61253845A | 1986-11-11 | |||
| JP2013115282A | 2013-06-10 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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