Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/029255
Kind Code:
A1
Abstract:
An electronic device according to an embodiment of the present invention comprises: a chip; a semiconductor substrate; a bump; an insulating film; and a metal film. The chip is provided with a semiconductor laser. The semiconductor substrate is provided with a drive circuit that drives the semiconductor laser. The bump connects a plurality of chip-side connection pads provided to the main surface of the chip on a side opposite to the emission surface of a laser beam and a plurality of substrate-side connection pads provided to the main surface of the semiconductor substrate on a side opposite to the chip. The insulating film is provided to the same layer as that of the substrate-side connection pads, and insulates the adjacent substrate-side connection pads from each other. The metal film is provided on the insulating film.
Inventors:
IMAHIGASHI TAKASHI (JP)
Application Number:
PCT/JP2023/024719
Publication Date:
February 08, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01S5/023; H01L21/60; H01S5/0234
Domestic Patent References:
| WO2021149389A1 | 2021-07-29 | |||
| WO1998003990A1 | 1998-01-29 | |||
| WO2020162390A1 | 2020-08-13 |
Foreign References:
| JPS61122614A | 1986-06-10 | |||
| JPH10268298A | 1998-10-09 | |||
| JP2004214469A | 2004-07-29 | |||
| JP2009016588A | 2009-01-22 | |||
| US20210381960A1 | 2021-12-09 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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