Title:
EPOXY COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, PRODUCING METHODS THEREFOR, SEALING MATERIAL, SEMICONDUCTOR DEVICE, METHOD FOR SEALING SEMICONDUCTOR ELEMENT, AND METHOD FOR USING SAME AS SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/182141
Kind Code:
A1
Abstract:
Provided is a glycidyl amine-type fluorine-containing epoxy compound. The present disclosure relates to a fluorine-containing epoxy compound represented by general formula (1). In general formula (1), n each independently represents an integer of 0 to 4, and R1 each independently represents a monovalent substituent and is one selected from the group consisting of a halogen atom, an alkyl group, an alkoxy group, a haloalkoxy group, and an aryl group.
Inventors:
SUZUKI SOTA (JP)
HOSOI KENJI (JP)
HOSOI KENJI (JP)
Application Number:
PCT/JP2023/010318
Publication Date:
September 28, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
C08G59/10; C07D301/27; C07D303/36; C08G59/32; C08J5/24; C08K7/02; C08L63/00; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021172319A1 | 2021-09-02 | |||
| WO2020162408A1 | 2020-08-13 | |||
| WO2022009782A1 | 2022-01-13 | |||
| WO2022014425A1 | 2022-01-20 | |||
| WO2022030447A1 | 2022-02-10 | |||
| WO2022030429A1 | 2022-02-10 |
Foreign References:
| JPS5874674A | 1983-05-06 | |||
| CN102527265A | 2012-07-04 | |||
| JP2022122814A | 2022-08-23 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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