EPOXY RESIN COMPOSITION AND PREPREG

WIPO Patent Application WO/2023/053869

A1

The present invention addresses the problem of providing a resin composition having exceptional light resistance, and a prepreg that has exceptional light resistance and handleability at room temperature and that has less resin flow during curing. In order to overcome the above problem, the present invention provides a resin composition having the constitution disclosed below. 　An epoxy resin composition containing constituent elements [A], [B], [C], and [D], a non-aromatic epoxy resin represented by formula (I) in which n is 1 representing at least 95 mass% of the total mass of constituent element [B]. [A] A non-aromatic epoxy resin other than constituent element [B]. [B] A non-aromatic epoxy resin represented by formula (I). R1 is any group ("non-aromatic organic group") from among divalent groups in which a non-aromatic hydrocarbon and a non-aromatic hydrocarbon group are linked via an ether group or an amino group (–NR–; where R is a non-aromatic hydrocarbon group). R2 and R3 are non-aromatic organic groups in which the hydrogen atom of the non-aromatic hydrocarbon group thereof is substituted by at least one epoxy group and at least one hydroxyl group. Each of R4 and R5 is a non-aromatic organic group in which the hydrogen atom of the non-aromatic hydrocarbon group is substituted by at least one epoxy group and at least one hydroxyl group, a non-aromatic hydrocarbon group forming part of a nitrogen-containing heterocycle, or a hydrogen atom. In formula (I), n is an integer from 1 to 5, and each of R1, R2, R3, R4, and R5 is a hydrogen atom, or a linear, a branched, or a cyclic structure. [C] A curing agent. [D] A non-aromatic thermoplastic resin.

JP4598402	Polymerization of reactive diluents in the presence of epoxy-amine materials, and coating compositions prepared thereby.
JP2797964	INDUSTRIAL APPLICABILITY: Epoxy resin curing agent for semiconductor encapsulation and composition

IKEDA YUKI (JP)
MACHIDA GINPEI (JP)
TAKETA ICHIRO (JP)

PCT/JP2022/033520

April 06, 2023

September 07, 2022

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TORAY INDUSTRIES (JP)

C08L63/00; C08J5/24; C08K3/011

WO2016013622A1

2016-01-28

JP2021120215A	2021-08-19
JP2021147550A	2021-09-27
JP2014145018A	2014-08-14
JP2003026763A	2003-01-29

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