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Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/075599
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin composition for semiconductor encapsulation essentially containing an epoxy resin, a phenol resin, a curing accelerator and an inorganic filler which is characterized in that a spherical molten silica having a pH of not less than 3 and not more than 5 as well as an eutectic material composed of silicon dioxide and titanium oxide or an eutectic material composed of silicon dioxide and alumina are contained as components of the inorganic filler. This epoxy resin composition is excellent in fluidity and moldability.

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Inventors:
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2006/300186
Publication Date:
July 20, 2006
Filing Date:
January 11, 2006
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
NAKAMURA ATSUSHI (JP)
International Classes:
C08L63/00; C08K3/00; H01L23/29; H01L23/31
Foreign References:
JP2002080694A2002-03-19
JPH1135801A1999-02-09
JPH07133406A1995-05-23
JPS5469126A1979-06-02
JP2005336362A2005-12-08
Attorney, Agent or Firm:
Kishimoto, Tatsuhito c/o Tokyo, Central Patent Firm (4th Floor Oak Building Kyobashi, 16-10, Kyobashi 1-chom, Chuou-ku Tokyo 31, JP)
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