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Title:
EQUALISATION CIRCUIT, PACKAGING APPARATUS, AND DATA TRANSMISSION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/191519
Kind Code:
A1
Abstract:
An equalisation circuit, comprising a receiver impedance network (Zt) arranged inside a receiver chip (RX) and a passive equaliser (100) arranged outside the receiver chip (RX); the receiver impedance network (Zt) is connected to the passive equaliser (100) by means of a first connecting member (201) and a second connecting member (202), and is connected to a first wire (203) and a second wire (204) of differential wires by means of the first connecting member (201) and the second connecting member (202) respectively, the differential wires being used for connecting the receiver chip (RX) and a transmitter chip (TX). A packaging apparatus and a data transmission apparatus; connection of the receiver impedance network (Zt) and the passive equaliser (100) is implemented by means of the first connecting member (201) and the second connecting member (202), such that the receiver impedance network (Zt) works in conjunction with the passive equaliser (100) to form adjustable receiver bandwidth gain by means of adjusting the resistance of the receiver impedance network (Zt), thereby increasing the working frequency; the passive equaliser (100) is arranged outside the receiver chip (RX) and is connected to the first connecting member (201) and the second connecting member (202), and thus does not occupy additional wiring space or chip area.

Inventors:
LUO DUONA (CN)
FAN WENKAI (CN)
CAI SHUJIE (CN)
Application Number:
PCT/CN2019/079223
Publication Date:
October 01, 2020
Filing Date:
March 22, 2019
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L25/065; H04L25/03
Foreign References:
CN101510544A2009-08-19
CN103346778A2013-10-09
US20130215954A12013-08-22
CN103746671A2014-04-23
Other References:
See also references of EP 3920218A4
Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
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