Title:
FILM, LAMINATE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/191012
Kind Code:
A1
Abstract:
An embodiment of the present invention provides: a film having a layer A and a layer B on at least one surface of the layer A, wherein the ratio of the elastic modulus of the layer A at 160°C to the elastic modulus of the layer B at 160°C is at least 1.2, and the thermal conductivity of the layer A is at least 0.05 W/(m·K); a laminate having a layer A, a layer B, and a metal layer or metal wiring in this order, wherein the ratio of the elastic modulus of the layer A at 160°C to the elastic modulus of the layer B at 160°C is at least 1.2, and the thermal conductivity of the layer A is at least 0.05 W/(m·K); and a method for manufacturing a laminate, the method comprising a step A for forming a layer A by applying a composition A containing a liquid crystal polymer, a filler having a thermal conductivity of at least 0.05 W/(m·K), and a solvent, and a step B for forming a layer B on at least one surface of the layer A by applying a composition B containing a liquid crystal polymer and a solvent.
Inventors:
SASADA YASUYUKI (JP)
HARA MIYOKO (JP)
HARA MIYOKO (JP)
Application Number:
PCT/JP2023/013432
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/022; H05K1/03
Domestic Patent References:
| WO2022113961A1 | 2022-06-02 |
Foreign References:
| JP2013038094A | 2013-02-21 | |||
| JP2004050704A | 2004-02-19 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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