Title:
FILM AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/191011
Kind Code:
A1
Abstract:
An embodiment of the present invention relates to: a film which comprises a layer A and a layer B, which is on at least one surface of layer A, wherein the dielectric loss tangent of the film is not more than 0.010, and the ratio of the rate of absorption of layer B at a wavelength of 355nm relative to the rate of absorption of layer A at a wavelength of 355nm is 0.45 to 1.00, inclusive; and a laminate which comprises the film comprising layer A and layer B and a metal layer or metal wiring that is on the layer B side of the film, wherein the dielectric loss tangent of the film is not more than 0.010, and the ratio of the rate of absorption of layer B at a wavelength of 355nm relative to the rate of absorption of layer A at a wavelength of 355nm is 0.45 to 1.00, inclusive.
Inventors:
HARA MIYOKO (JP)
SASADA YASUYUKI (JP)
SASADA YASUYUKI (JP)
Application Number:
PCT/JP2023/013431
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B7/023; B32B7/025; B32B15/08; B32B27/34; H05K1/03
Domestic Patent References:
| WO2013065453A1 | 2013-05-10 |
Foreign References:
| JP2003062942A | 2003-03-05 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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