Title:
FILM AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/191010
Kind Code:
A1
Abstract:
Provided are a film and a laminate using the film, the film comprising a layer A and a layer B, which is on at least one surface of layer A, the elastic modulus of layer A at 160°C being 100-2,500 MPa, and the difference LA-LB between the value LA obtained by subtracting the remaining weight rate of layer A at 900°C from the remaining weight rate of layer A at 440°C and the value LB obtained by subtracting the remaining weight rate of layer B at 900°C from the remaining weight rate of layer B at 440°C being not greater than 80%.
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Inventors:
HARA MIYOKO (JP)
SASADA YASUYUKI (JP)
SASADA YASUYUKI (JP)
Application Number:
PCT/JP2023/013430
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B7/022; B32B15/08; H05K1/03
Foreign References:
| JP2014231566A | 2014-12-11 | |||
| CN111002644A | 2020-04-14 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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