Title:
FIXED-ABRASIVE-GRAIN MACHINING APPARATUS, FIXED-ABRASIVE-GRAIN MACHINING METHOD, AND SEMICONDUCTOR-WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/140684
Kind Code:
A1
Abstract:
A fixed-abrasive-grain machining apparatus, a fixed-abrasive—grain machining method, and a semiconductor-wafer manufacturing method to be used in manufacturing wafers, wherein the fixed-abrasive-machining apparatus (1) is provided with: a lower-side fixed-abrasive-grain layer (21) formed on the upper face of a lower surface plate (2); an upper-side fixed-abrasive-grain layer (31) formed on the lower face of an upper surface plate (3); a carrier plate (4) installed horizontally between the lower surface plate (2) and the upper surface plate (3), and which has multiple holes (4a) formed, which accommodate semiconductor wafers (W); and a carrier circular-motion apparatus (40) that makes the carrier plate (4) make circular-motions; and furthermore, the lower-side fixed-abrasive-grain layer (21) and the upper-side fixed-abrasive-grain layer (31) have elastic bodies (21a, 31a) fixed, in a state with abrasive grains (21b, 31b) having a grain-diameter of 4 μm or less scattered, respectively; in order to be able to obtain a good degree of flatness at the surface of the semiconductor wafer, and furthermore, to make the number of processes fewer, and minimize the increase in the footprint of equipment; and the fixed-abrasive-grain machining apparatus (1) is to be used in a manufacturing process of semiconductor wafers (W).
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Inventors:
HASHII TOMOHIRO (JP)
KAKIZONO YUICHI (JP)
KUROSAWA YOSHIAKI (JP)
KAKIZONO YUICHI (JP)
KUROSAWA YOSHIAKI (JP)
Application Number:
PCT/JP2010/059548
Publication Date:
December 09, 2010
Filing Date:
June 04, 2010
Export Citation:
Assignee:
SUMCO CORP (JP)
HASHII TOMOHIRO (JP)
KAKIZONO YUICHI (JP)
KUROSAWA YOSHIAKI (JP)
HASHII TOMOHIRO (JP)
KAKIZONO YUICHI (JP)
KUROSAWA YOSHIAKI (JP)
International Classes:
H01L21/304; B24B7/24; B24B37/04
Foreign References:
| JP2006198701A | 2006-08-03 | |||
| JPH09174425A | 1997-07-08 | |||
| JP2006237055A | 2006-09-07 | |||
| JP2006100799A | 2006-04-13 |
Other References:
See also references of EP 2439768A4
Attorney, Agent or Firm:
SANADA, TAMOTSU (JP)
Sanada 有 (JP)
Sanada 有 (JP)
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