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Patent Searching and Data


Title:
FLEXIBLE SUBSTRATE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/153149
Kind Code:
A1
Abstract:
Disclosed in the present invention is a preparation method for a flexible substrate, comprising the following steps: providing a rigid substrate; forming at least one patterned photoresist layer on the rigid substrate; forming a flexible substrate on each photoresist layer; and emitting laser light to the side of the rigid substrate distant from the flexible substrate, making the laser light pass through the rigid substrate and then illuminate the photoresist layer, and stripping the flexible substrate and the photoresist layer from the rigid substrate, thereby forming the flexible substrate. Because the photoresist layer is formed on the rigid substrate, the flexible substrate can be stripped more easily, the stripping efficiency of the flexible substrate is improved, damages to the structure of the flexible substrate are avoided during the stripping process, and thus the process yield of flexible substrates is improved. The present invention also provides a flexible substrate and an electronic device.

Inventors:
ZHOU LIBIN (CN)
REN ZHUYUN (CN)
Application Number:
PCT/CN2018/075645
Publication Date:
August 15, 2019
Filing Date:
February 07, 2018
Export Citation:
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Assignee:
SHENZHEN ROYOLE TECHNOLOGIES CO LTD (CN)
International Classes:
H01L27/32; H01L21/02
Foreign References:
CN107342305A2017-11-10
CN103985665A2014-08-13
US8729673B12014-05-20
CN103560075A2014-02-05
CN104465479A2015-03-25
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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