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Patent Searching and Data


Title:
FORMULATION COMPOSITION, FORMULATION, AND METHOD FOR PRODUCING FORMULATION COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/145870
Kind Code:
A1
Abstract:
The present invention provides: a formulation composition that makes it possible to easily obtain a formulation which has high hardness and is easily produced; a formulation that includes said composition; and a method for producing the formulation composition. A formulation composition according to the present invention comprises particles containing a filler, an active component, and a binding agent, wherein: the particles contain the filler and the active component in an amount of 80-95 mass% with respect to the total mass of the filler, the active component, and the binding agent; the content of the filler is 1-94 mass% with respect to the total mass of the filler, the active component, and the binding agent; and the coverage ratio of the binding agent on the surface of the particles is not less than 20%.

Inventors:
FUJISAKI MOTOHARU (JP)
KIMURA AKIRA (JP)
Application Number:
PCT/JP2023/002613
Publication Date:
August 03, 2023
Filing Date:
January 27, 2023
Export Citation:
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Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
A61K9/16; A61K9/20; A61K31/167; A61K47/02; A61K47/10; A61K47/32; A61K47/38; A61P29/00
Domestic Patent References:
WO2021089848A12021-05-14
Foreign References:
JP2016124800A2016-07-11
JPH11335268A1999-12-07
US20100159018A12010-06-24
JP2017122056A2017-07-13
JPS6191118A1986-05-09
JP2005527508A2005-09-15
JP2013501810A2013-01-17
JP2014524925A2014-09-25
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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