Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FOUR-BAR LINKAGE WAFER CLAMPING MECHANISM
Document Type and Number:
WIPO Patent Application WO2003003419
Kind Code:
A3
Abstract:
The wafer clamping mechanism comprises a linkage mechanism and a wafer contact point coupled to the linkage mechanism. The linkage mechanism includes a four-bar linkage having: a first link having a first fixed pivot and a first floating pivot remote from the first fixed pivot; a second link having a second fixed pivot and a second floating pivot remote from the second fixed pivot; and a third link having a first coupling pivot rotatably coupled to the first floating pivot, and having a second coupling pivot rotatably coupled to the second floating pivot. In use motion of the linkage mechanism causes the wafer contact point to clamp a wafer.

More Like This:
WO/2018/102305TRANSLATING AND ROTATING CHUCK FOR PROCESSING MICROELECTRONIC SUBSTRATES IN A PROCESS CHAMBER
JP4777345Lift pin with roller glide to reduce friction
WO/2022/245761MOVABLE DISK WITH APERTURE FOR ETCH CONTROL
Inventors:
COX DAMON K
MENON VENUGOPAL
Application Number:
PCT/US2002/020401
Publication Date:
August 21, 2003
Filing Date:
June 27, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
APPLIED MATERIALS INC (US)
International Classes:
H01L21/687; (IPC1-7): H01L21/00
Foreign References:
US6216883B12001-04-17
EP1041604A22000-10-04
Other References:
PATENT ABSTRACTS OF JAPAN vol. 011, no. 372 (M - 648) 4 December 1987 (1987-12-04)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13)
PATENT ABSTRACTS OF JAPAN vol. 012, no. 196 (E - 618) 7 June 1988 (1988-06-07)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: LOCATOR PIN INTEGRATED WITH SENSOR FOR DETECTING SEMICONDUCTOR SUBSTRATE CARRIER

Next Patent: OPTICAL CHIP PACKAGING VIA THROUGH HOLE