HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE

Title:

HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE

Document Type and Number:

WIPO Patent Application WO/2018/055889

Kind Code:

A1

Abstract:

Provided are: a heat bonding sheet with which it is possible to stably obtain a sintered layer having desired characteristics, and in which changes in composition can be inhibited; and a heat bonding sheet with a dicing tape, having said heat bonding sheet. A heat bonding sheet having a precursor that becomes a sintered layer by heating, wherein the weight loss ΔW0(%), when an analysis by differential thermogravimetric analysis is performed in a nitrogen atmosphere from 23°C to 400°C at a temperature increase speed of 10 °C/min before the heat bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20%, and the weight loss ΔW24(%), when an analysis by differential thermogravimetric analysis is performed in a nitrogen atmosphere from 23°C to 400°C at a temperature increase speed of 10 °C/min after the heat bonding sheet has been exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20%, satisfy the following relationship (3). -1% ≤ ΔW0-ΔW24 ≤ 0.5% (3)

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Inventors:

SUGO YUKI (JP)
HONDA SATOSHI (JP)

Application Number:

PCT/JP2017/026085

Publication Date:

March 29, 2018

Filing Date:

July 19, 2017

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

H01L21/52; H01L21/301

Domestic Patent References:

WO2016031551A1

2016-03-03

Foreign References:

JP2013214733A	2013-10-17
JP2014111800A	2014-06-19
JPS60196956A	1985-10-05
JP2013007028A	2013-01-10

Other References: