Title:
HEAT CURABLE RESIN COMPOSITION, CURED FILM, SUBSTRATE WITH CURED FILM, ELECTRONIC COMPONENT, AND INKJET INK
Document Type and Number:
WIPO Patent Application WO/2018/190347
Kind Code:
A1
Abstract:
The heat curable resin composition according to the present invention is provided as a heat curable resin composition showing both high low-temperature curability and high storage stability such that the heat curable resin composition allows low-temperature curing at 120ºC or less and shows good storage stability before low-temperature curing. The heat curable resin composition comprises a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, and a thiol compound (E) having a plurality of thiol groups in a molecule, and thus, the heat curable resin composition enables low-temperature curing while maintaining good storage stability until low-temperature curing.
Inventors:
KIKUCHI AYAKO (JP)
FURUTA TOMOTSUGU (JP)
MOROKOSHI SHINTA (JP)
FURUTA TOMOTSUGU (JP)
MOROKOSHI SHINTA (JP)
Application Number:
PCT/JP2018/015135
Publication Date:
October 18, 2018
Filing Date:
April 10, 2018
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08G59/66; B41J2/01; C08G59/20; C08G59/46; C09D11/30; C09D163/00; C09D179/08; C09D181/02; G06F3/041
Domestic Patent References:
| WO2009093467A1 | 2009-07-30 | |||
| WO2013005441A1 | 2013-01-10 |
Foreign References:
| JP2001181276A | 2001-07-03 | |||
| JP2016138264A | 2016-08-04 | |||
| JP2008033244A | 2008-02-14 | |||
| JP2018016786A | 2018-02-01 |
Attorney, Agent or Firm:
OKUBO, Katsuyuki (JP)
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