Title:
THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE PROVIDED WITH CURED FILM, ELECTRONIC COMPONENT, AND INK JET INK
Document Type and Number:
WIPO Patent Application WO/2018/190346
Kind Code:
A1
Abstract:
A thermosetting resin composition according to the present invention comprises a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, a coloring agent (D), and a thiol compound (E) having a plurality of thiol groups in the molecule, and is thus capable of forming a cured film having favorable adhesion to PET via low-temperature curing at 120°C or less while retaining favorable preservation stability prior to low-temperature curing. The thiol compound (E) content is preferably 0.1 to 20 parts by weight in 100 parts by weight of the solid content within the thermosetting resin composition (excluding the solvent from the full solution).
Inventors:
ANDO TATSUYA (JP)
DEYAMA YOSHIHIRO (JP)
MOROKOSHI SHINTA (JP)
DEYAMA YOSHIHIRO (JP)
MOROKOSHI SHINTA (JP)
Application Number:
PCT/JP2018/015134
Publication Date:
October 18, 2018
Filing Date:
April 10, 2018
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08G59/40; B41J2/01; B41M5/00; C08G73/10; C08L63/00; C08L79/08; C09D11/36
Domestic Patent References:
| WO2012176694A1 | 2012-12-27 | |||
| WO2017027482A1 | 2017-02-16 |
Foreign References:
| JPH0776658A | 1995-03-20 | |||
| JPH0931306A | 1997-02-04 | |||
| JP2015078253A | 2015-04-23 |
Attorney, Agent or Firm:
OKUBO, Katsuyuki (JP)
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