Title:
HEAT-EMITTING SUBSTRATE AND VAPOR CHAMBER
Document Type and Number:
WIPO Patent Application WO/2024/019108
Kind Code:
A1
Abstract:
This heat-emitting substrate comprises: a housing having an internal space; and a sealing body that seals the internal space. The housing includes: a through hole that connects to the internal space; and an inside bottom surface. The sealing body has: a first portion located in the internal space; and a second portion located in the though hole. The first portion contacts the inside bottom surface. In a vertical cross-section, the maximum width of the first portion is greater than the minimum width of the through hole.
Inventors:
KONISHI YOSHITADA (JP)
Application Number:
PCT/JP2023/026555
Publication Date:
January 25, 2024
Filing Date:
July 20, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
F28D15/02; B21D39/00; H01L23/427; H05K7/20
Domestic Patent References:
| WO2021182644A1 | 2021-09-16 |
Foreign References:
| CN106225533A | 2016-12-14 | |||
| JP2007315745A | 2007-12-06 | |||
| JPH0321679U | 1991-03-05 | |||
| JP4035155B1 | 2008-01-16 | |||
| JPS53106961A | 1978-09-18 | |||
| JPS5885555A | 1983-05-21 |
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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