Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/075170
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a heat-resistant resin composition which has heat resistance and excellent fluidity and impact resistance. According to the present invention, provided is a heat-resistant resin composition containing a maleimide-based copolymer (A) and at least one resin (B) selected from among an ABS resin, an ASA resin, an AES resin and an SAN resin, wherein the weight average molecular weight of an MEK-soluble component contained in the heat-resistant resin composition is 80,000-120,000, a maleimide-based monomer unit contained in 100 mass% of the MEK-soluble component is 7-16 mass%, and a gel component contained in 100 mass% of the heat-resistant resin composition is 15-24 mass%.
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Inventors:
NISHINO KOHEI (JP)
ENDO MASAMICHI (JP)
ENDO MASAMICHI (JP)
Application Number:
PCT/JP2021/036090
Publication Date:
April 14, 2022
Filing Date:
September 30, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L25/04; C08L35/00; C08L101/00
Domestic Patent References:
| WO2008026554A1 | 2008-03-06 | |||
| WO2016186133A1 | 2016-11-24 | |||
| WO2010082617A1 | 2010-07-22 | |||
| WO2008026554A1 | 2008-03-06 |
Foreign References:
| JPH0741624A | 1995-02-10 | |||
| JPH09143319A | 1997-06-03 | |||
| JPH1135760A | 1999-02-09 | |||
| JP2004323772A | 2004-11-18 | |||
| JP2004346148A | 2004-12-09 | |||
| JP2005298774A | 2005-10-27 | |||
| JP2005298776A | 2005-10-27 | |||
| JP2005298774A | 2005-10-27 | |||
| JP2005298776A | 2005-10-27 |
Other References:
See also references of EP 4227362A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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