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Title:
HIGH FREQUENCY COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/042990
Kind Code:
A1
Abstract:
The purpose of the present invention is to minimize the size of a component overall without reducing the Q factor of inductor components. First electrode non-formed regions A, which do not form first wired electrodes such as an internal wired electrode 22 or an external connected terminal 24, are set in a range where an inductor component 19 overlaps in a planar view with at least one dielectric layer 141-143 on a first substrate 14, and second electrode non-formed regions B, which do not form second wired electrodes such as an internal wired electrode 25 or a mounting electrode 26, are set in a range where one inductor component 19 overlaps in a planar view with at least one dielectric layer 161-163 on a second substrate 16, and thus reduction in the inductance can be limited by the first and second wired electrodes blocking the magnetic field of the inductor components 19. Therefore, being configured to a stack structure can minimize the size of the component overall without reducing the Q factor of the inductor components 19.

Inventors:
HINO SEIGO (JP)
Application Number:
PCT/JP2015/073957
Publication Date:
March 24, 2016
Filing Date:
August 26, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H03H7/01; H03H7/12; H03H9/64; H04B1/40
Foreign References:
JP2006261387A2006-09-28
JP2013102194A2013-05-23
JP2008218566A2008-09-18
JP2005217852A2005-08-11
JP2014014131A2014-01-23
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
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