HIGH-FREQUENCY MODULE, PRODUCTION METHOD FOR HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE

Title:

HIGH-FREQUENCY MODULE, PRODUCTION METHOD FOR HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/139979

Kind Code:

A1

Abstract:

The present invention improves the heat dissipation and shielding properties of a high-frequency module. A high-frequency module (100) has an electronic component (1) that has: a principal surface (11) that is on the opposite side from a mounting substrate (9); and an outer circumferential surface (13). A resin layer (5) covers at least a portion of the outer circumferential surface (13) of the electronic component (1). A metal electrode layer (6) covers the principal surface (11) of the electronic component (1) and a principal surface (51) of the resin layer (5) that is on the opposite side from the mounting substrate (9). As seen in plan view from the thickness direction (D1) of the mounting substrate (9), an outer edge (11A) of the principal surface (11) of the electronic component (1) is positioned inside an outer edge (10) of the electronic component (1). The electronic component (1) also has an inclined surface (12). The inclined surface (12) connects the principal surface (11) of the electronic component (1) and the outer circumferential surface (13) of the electronic component (1). The metal electrode layer (6) is provided across the principal surface (11) of the electronic component (1), the inclined surface (12) of the electronic component (1), and the principal surface (51) of the resin layer (5).

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Inventors:

ONO MAYUKA
TSUDA MOTOJI

Application Number:

PCT/JP2022/045878

Publication Date:

July 27, 2023

Filing Date:

December 13, 2022

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H01L23/00; H01L23/02; H01L23/28; H01L23/29; H03H9/25; H04B1/38

Domestic Patent References:

WO2018092529A1

2018-05-24

Foreign References:

JP2010192653A

2010-09-02

Attorney, Agent or Firm:

HOKUTO PATENT ATTORNEYS OFFICE (JP)

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