HIGH FREQUENCY MODULE-USE COMPONENT AND HIGH FREQUENCY MODULE

Title:

HIGH FREQUENCY MODULE-USE COMPONENT AND HIGH FREQUENCY MODULE

Document Type and Number:

WIPO Patent Application WO/2005/074069

Kind Code:

A1

Abstract:

A high frequency module small in insertion loss, comprising a high frequency module-use component (2) that is respectively formed with a guide-tube type waveguide-use recess (8) and cut-off waveguide-use recesses (9), (10) communicating with the guide-tube type waveguide-use recess (8), and has short-circuit columns (5), (6) erected at the boundaries between the guide-tube type waveguide-use recess (8) and the cut-off waveguide-used recesses (9), (10), a ground electrode (11) disposed in contact with one surface (4a) of the component (2) to close the recess (8) at the contact surface with the component (2), and a substrate (3) formed with TEM mode lines (12), (13) contacting the tip ends of the short-circuit columns (5), (6).

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Inventors:

FUKUNAGA TATSUYA (JP)

Application Number:

PCT/JP2005/000844

Publication Date:

August 11, 2005

Filing Date:

January 24, 2005

Export Citation:

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Assignee:

TDK CORP (JP)
FUKUNAGA TATSUYA (JP)

International Classes:

H01P1/207; H01P1/208; H01P5/107; (IPC1-7): H01P5/107; H01P1/207

Foreign References:

JP2003289204A	2003-10-10
JP2003078312A	2003-03-14
JP2000252711A	2000-09-14

Attorney, Agent or Firm:

Mitazaki, Taiji (9-5 Shinjuku 1-chom, Shinjuku-ku Tokyo 22, JP)

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