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Title:
HOT PRESSING DEVICE FOR ACF GLUE FILM COUPLING STRUCTURE AND PROCESS THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/019774
Kind Code:
A1
Abstract:
The present invention relates to a hot pressing device for an ACF glue film coupling structure and a process thereof. The hot pressing device comprises a transfer module and a first mounting plate connected to the transfer module; a negative pressure adsorption module, at least one positioning module, and a lifting module are all disposed on the first mounting plate. A local pressing module provided with a hot pressing assembly is provided at each of the four corners of the first mounting plate, and a cleaning module corresponding to the position of the local pressing module is further provided below the first mounting plate in the transfer module. In the present invention, by means of providing the cleaning module, overflowing glue on a heat conducting block in the hot pressing module can be quickly removed, thus the flatness of the surface of a second part that is hot pressed on the heat conducting block is ensured, such that the resistance value after a hot-pressed ACF glue film is connected to a base material meets customer requirements. Moreover, the degree of automation of the whole cleaning process is high, labor is saved, labor costs are reduced, time and labor are saved, and the problem that glue traditionally needs to be cleaned manually is prevented.

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Inventors:
XU ZHENGLIANG (CN)
ZHENG LIANG (CN)
XU ZHENG (CN)
Application Number:
PCT/CN2021/131081
Publication Date:
February 23, 2023
Filing Date:
November 17, 2021
Export Citation:
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Assignee:
JIANGSU TELILAN COATING TECH CO LTD (CN)
International Classes:
G02F1/13; B24B27/033; B24B41/04; B24B47/22; G09F9/35
Foreign References:
CN113900292A2022-01-07
CN204883102U2015-12-16
CN204433780U2015-07-01
CN109976004A2019-07-05
CN101995683A2011-03-30
JP2000263005A2000-09-26
Attorney, Agent or Firm:
RAYSHINE INTELLECTUAL PROPERTY AGENCY GP. (CN)
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