IMAGING DEVICE AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2021/193915

A1

Provided is an imaging device (1) equipped with a plurality of imaging elements (100). Each of the plurality of imaging elements has: a plurality of pixels (300a, 300b) containing a first-conductivity-type impurity; an element separation wall (310) provided so as to surround the plurality of pixels and penetrate through a semiconductor substrate (10); an on-chip lens (200) provided above the light-receiving surface (10a) of the semiconductor substrate so as to be shared by the plurality of pixels; and a first separation part (304) provided in the region surrounded by the element separation wall, the first separation part (304) separating the plurality of pixels. The first separation part is provided so as to extend in the thickness direction of the semiconductor substrate. A first diffusion region (306) containing a second-conductivity-type impurity having a conductivity type opposite to the first conductivity type is provided in an area that is located in the surroundings of the first separation part and that extends in the thickness direction of the semiconductor substrate.

MATSUMOTO AKIRA (JP)
ZAITSU KOICHIRO (JP)
NISHIDA KEIJI (JP)
NISHIDA MIZUKI (JP)
IZUKASHI KAZUTAKA (JP)
ITO DAISUKE (JP)
MIYOSHI YASUFUMI (JP)
YAMAMOTO JUNPEI (JP)
TANAKA YUSUKE (JP)
HAMAMOTO YASUSHI (JP)

PCT/JP2021/012841

September 30, 2021

March 26, 2021

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SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

H01L31/10; H01L21/22; H01L21/225; H01L21/265; H01L21/76; H01L27/146; H04N5/369

JP2017212351A	2017-11-30
JP2018201015A	2018-12-20
JP2009158800A	2009-07-16
JP2013084742A	2013-05-09
JP2000292685A	2000-10-20

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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