Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/189165
Kind Code:
A1
Abstract:
An information processing device (5) comprises: an information acquisition unit (500) that acquires operating status information including top ring status information, polishing table status information, polishing fluid supply nozzle status information, dresser status information, and atomizer status information as operating states when a substrate processing device that performs a chemical-mechanical polishing treatment on a substrate is operated; and a status prediction unit (501) that predicts polishing pad status information for the operating status information by inputting the operating status information acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning to learn correlations between the operating status information and the polishing pad status information.
Inventors:
TAKEBUCHI KENICHI (JP)
SAITO KENICHIRO (JP)
SAITO KENICHIRO (JP)
Application Number:
PCT/JP2023/007774
Publication Date:
October 05, 2023
Filing Date:
March 02, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/12; B24B49/00; B24B53/017
Foreign References:
| JP2012192511A | 2012-10-11 | |||
| JP2021028099A | 2021-02-25 | |||
| JP2020109839A | 2020-07-16 | |||
| US20200130130A1 | 2020-04-30 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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