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Patent Searching and Data


Title:
INFRARED SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/084809
Kind Code:
A1
Abstract:
Provided is an infrared sensor that suppresses transmission of heat from a light guiding path member and allows high-precision measurement. An infrared sensor according to the present invention comprises: a mounting substrate 21; an infrared sensor body 1 that is provided to the mounting substrate; and a light guiding path member 22 that is positioned on the mounting substrate and has an opening section 22b above the infrared sensor body, wherein the infrared sensor body comprises an insulating substrate, a heat-sensitive element for detection and a heat-sensitive element for compensation that are provided to the insulating substrate, an infrared shielding section 5 that is provided to the insulating substrate, and an infrared light receiving region 6 on the insulating substrate, the heat-sensitive element for detection is positioned directly below the light receiving region, the heat-sensitive element for compensation is positioned directly below the infrared shielding section, the light guiding path member is a polygonal tube shape that has a rectangular opening section, and the light receiving region is positioned in the center of the light guiding path member in the direction of the long side of the opening section, and is a substantially rectangular shape that has the long side thereof in the direction of the short side of the opening section 22b.

Inventors:
HIRANO SHINGO (JP)
NAKAMURA KENJI (JP)
SHIRATA KEIJI (JP)
Application Number:
PCT/JP2019/012430
Publication Date:
April 30, 2020
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
G01J1/02; G01J5/10
Foreign References:
JPH07324979A1995-12-12
JP2017181031A2017-10-05
JP2012068115A2012-04-05
JP2014089108A2014-05-15
JP2013205063A2013-10-07
JPH10318829A1998-12-04
JP2014174127A2014-09-22
JP2014119280A2014-06-30
Attorney, Agent or Firm:
TAKAOKA Ryoichi (JP)
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