INORGANIC-CONTAINING PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING INORGANIC PATTERN

Title:

INORGANIC-CONTAINING PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING INORGANIC PATTERN

Document Type and Number:

WIPO Patent Application WO/1999/035536

Kind Code:

A1

Abstract:

An inorganic-containing photosensitive resin composition which comprises (A) a photosensitive polymer, (B) a hydrolytically polymerizable organometallic compound or a condensate thereof, and (C) a functional inorganic filler is applied to a substrate, and the coating is exposed to light and developed to form a pattern, which is baked to form an inorganic pattern. The photosensitive polymer (A) may comprise an oligomer or polymer and a photosensitizer. The hydrolytically polymerizable organometallic compound (B) may contain a photosensitive group and the inorganic filler may be monodisperse colloidal silica having an average particle diameter of 2 to 100 nm. The amounts of ingredients (B) and (C) on a solid basis are about 1 to 25 parts by weight and about 1 to 20 parts by weight, respectively, per part by weight of ingredient (A). Since the resin composition has high sensitivity even when having a high inorganic content, an inorganic pattern having excellent resolution can be formed therefrom.

Inventors:

HANABATA MAKOTO (JP)
YASUDA TOKUGEN (JP)

Application Number:

PCT/JP1998/005984

Publication Date:

July 15, 1999

Filing Date:

December 28, 1998

Export Citation:

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Assignee:

KANSAI RESEARCH INST (JP)
HANABATA MAKOTO (JP)
YASUDA TOKUGEN (JP)

International Classes:

G03F7/027; G03F7/00; G03F7/004; G03F7/075; H01L21/027; (IPC1-7): G03F7/004; C08K9/04; C08L101/00; C09C3/08; C09D5/00; C09D11/00; C09D201/00; G03F7/027

Foreign References:

JPS5311952A	1978-02-02
JPH025062A	1990-01-09
JPH05202146A	1993-08-10
JPH0619040A	1994-01-28
JPH08262700A	1996-10-11
JPH09230587A	1997-09-05
JPH03210703A	1991-09-13

Other References: