Title:
INSPECTION METHOD FOR LED CHIP, INSPECTION DEVICE FOR SAME AND METHOD FOR MANUFACTURING LED DISPLAY
Document Type and Number:
WIPO Patent Application WO/2019/082759
Kind Code:
A1
Abstract:
The present invention is a method for inspecting a plurality of LED chips 6 formed on a sapphire substrate 7, the method comprising: a first step in which the sapphire substrate 7 is placed and positioned on an inspection wiring board 11 such that contacts 10 of the plurality of LED chips 6 on the sapphire substrate 7 correspond to a plurality of electrode pads 12 provided on the inspection wiring board 11; a second step in which the contacts 10 of the plurality of LED chips 6 and the plurality of electrode pads 12 on the inspection wiring board 11 are electrically connected to each other; and a step 3 in which current is applied to the plurality of LED chips 6 via the inspection wiring board 11 to determine whether the LED chips 6 are defective.
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Inventors:
FUKAYA KOICHIRO (JP)
KAJIYAMA KOICHI (JP)
KAJIYAMA KOICHI (JP)
Application Number:
PCT/JP2018/038628
Publication Date:
May 02, 2019
Filing Date:
October 17, 2018
Export Citation:
Assignee:
V TECH CO LTD (JP)
International Classes:
G01R31/26; G01R31/00; H01L33/62
Domestic Patent References:
| WO2010007816A1 | 2010-01-21 | |||
| WO2013061500A1 | 2013-05-02 |
Foreign References:
| JP2008053289A | 2008-03-06 | |||
| JP2007073995A | 2007-03-22 | |||
| JP2009094181A | 2009-04-30 | |||
| JPH1012931A | 1998-01-16 |
Attorney, Agent or Firm:
OGAWA, Moriaki et al. (JP)
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