Title:
INSULATION BOARD AND PREPARATION METHOD THEREFOR, LAMINATE AND PREPARATION METHOD THEREFOR, AND APPLICATION OF INSULATION BOARD OR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/061970
Kind Code:
A1
Abstract:
Provided are an insulation board and a preparation method therefor, a laminate prepared from the insulation board and a preparation method therefor, and an application of the insulation board or the laminate. The insulation board comprises a first bonding layer, a fiber-reinforced substrate layer, and a second bonding layer, which are sequentially stacked; the fiber-reinforced substrate layer comprises a first transition layer, a first substrate layer, a fiber layer, a second substrate layer, and a second transition layer, which are sequentially stacked; the first bonding layer and the first transition layer are connected, and the second bonding layer and the second transition layer are connected; the material of the first transition layer is a material compatible with both the first substrate layer and the first bonding layer; the material of the second transition layer is a material compatible with both the second substrate layer and the second bonding layer; the material of the first or second substrate layer is a first fluororesin or a mixture of the first fluororesin and a filler; and the material of the first or second bonding layer is a second fluororesin or a mixture of the second fluororesin and a filler. The laminate prepared from the insulation board not only improves the peel strength, reduces the surface glass fiber texture, but also enables the insulation board to be thinner.
More Like This:
| JPH0762306 | [Title of Invention] Thermoformable Composite Sheet |
| JP2020131504 | HEAT INSULATION MATERIAL |
| WO/2014/068233 | METHOD FOR THE PRODUCTION OF THIN SHEET GLASS |
Inventors:
WANG HONGYUAN (CN)
ZHANG YILAN (CN)
WANG HEZHI (CN)
ZHANG YILAN (CN)
WANG HEZHI (CN)
Application Number:
PCT/CN2020/120363
Publication Date:
March 31, 2022
Filing Date:
October 12, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
International Classes:
B32B17/02; B32B5/08; B32B7/022; B32B7/025; B32B7/12; B32B9/00; B32B9/04; B32B15/04; B32B15/20; B32B17/04; B32B17/06; B32B27/04; B32B33/00; B32B37/02; B32B37/10; B32B38/18; H05K3/00
Foreign References:
| CN111052878A | 2020-04-21 | |||
| CN104553224A | 2015-04-29 | |||
| CN108859326A | 2018-11-23 | |||
| CN205167727U | 2016-04-20 | |||
| CN102114453A | 2011-07-06 | |||
| CN110039852A | 2019-07-23 | |||
| US6417459B1 | 2002-07-09 | |||
| US20150296614A1 | 2015-10-15 | |||
| CN207931227U | 2018-10-02 | |||
| CN110561857A | 2019-12-13 | |||
| CN102167873A | 2011-08-31 |
Attorney, Agent or Firm:
SHENZHEN CIPRUN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: