LASER MODULE AND METHOD FOR PRODUCING SAME

Title:

LASER MODULE AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2016/114224

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide: a highly reliable laser module which is suppressed in variation of bonding strength of a glass component that is affixed within the laser module by means of an adhesive, thereby exhibiting stable performance; and a method for producing this laser module. A method for producing a laser module according to the present invention is a method for producing a laser module wherein a lens is bonded to a glass member that is affixed to a metal member to which a semiconductor laser element is directly or indirectly affixed, and comprises (a) a step for cleaning the glass member with pure water and (b) a step for bonding the lens to the glass member by means of an epoxy adhesive 10 after the step (a).

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Inventors:

YABE MITORU (JP)

Application Number:

PCT/JP2016/050439

Publication Date:

July 21, 2016

Filing Date:

January 08, 2016

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

H01S5/02

Foreign References:

JP2004253783A	2004-09-09
JP2006284851A	2006-10-19
JP2004233885A	2004-08-19
JPS58168289A	1983-10-04
JPH0722708A	1995-01-24

Attorney, Agent or Firm:

YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)

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