Title:
LASER PROCESSING DEVICE, LASER PROCESSING METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/150549
Kind Code:
A1
Abstract:
Provided are a laser processing device and a laser processing method for preventing an extension of the processing time per semiconductor film. The laser processing device (1) according to one embodiment of the present invention comprises a laser light source (2) for irradiating laser light onto a semiconductor film (M1), a film state measuring apparatus (5) for measuring the state of the semiconductor film (M1) after having been irradiated with the laser light, and a laser light adjustment mechanism for adjusting, according to the state of the semiconductor film (M1) measured by the film state measuring apparatus (5), the timing of the laser light to be subsequently irradiated onto the semiconductor film (M1) and the intensity of this laser light.
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Inventors:
KOBAYASHI NAOYUKI (JP)
MACHIDA MASASHI (JP)
IMAMURA HIROAKI (JP)
MACHIDA MASASHI (JP)
IMAMURA HIROAKI (JP)
Application Number:
PCT/JP2018/003564
Publication Date:
August 08, 2019
Filing Date:
February 02, 2018
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD (JP)
International Classes:
H01L21/20
Foreign References:
| JP2006135192A | 2006-05-25 | |||
| JP2014029965A | 2014-02-13 | |||
| JP2007258234A | 2007-10-04 | |||
| JP2009158822A | 2009-07-16 | |||
| JP2004006876A | 2004-01-08 | |||
| JP2001338893A | 2001-12-07 | |||
| JP2002270510A | 2002-09-20 | |||
| JPH0531354A | 1993-02-09 | |||
| JP2012002905A | 2012-01-05 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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