LASER PROCESSING METHOD - HAMAMATSU PHOTONICS KK

Title:

LASER PROCESSING METHOD

Document Type and Number:

WIPO Patent Application WO/2012/014710

Kind Code:

A1

Abstract:

Disclosed is a laser processing method in which laser light (L) is focused inside a target object (1) formed from glass, thereby forming a modified region (7), and etching is performed along the modified region (7), thereby forming a through-hole (24) in the target object (1). Said method includes: a browning step in which at least part of the target object (1) is discolored via browning; a laser-light focusing step, after the browning step, in which laser light (L) is focused on the target object (1), thereby forming a modified region (7) in the discolored part of the target object (1); and an etching treatment step, after the laser-light focusing step, in which the target object (1) is etched, said etching being made to selectively progress along the modified region (7) to form the through-hole (24).

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Inventors:

SHIMOI HIDEKI (JP)
ARAKI KEISUKE (JP)

Application Number:

PCT/JP2011/066321

Publication Date:

February 02, 2012

Filing Date:

July 19, 2011

Export Citation:

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Assignee:

HAMAMATSU PHOTONICS KK (JP)
SHIMOI HIDEKI (JP)
ARAKI KEISUKE (JP)

International Classes:

B23K26/38; B23K26/00; B23K26/40; B23K26/42; C03C15/00; C03C23/00

Foreign References:

JP2009143787A	2009-07-02
JPH0574335A	1993-03-26
JP2010155259A	2010-07-15
JP2005206401A	2005-08-04

Other References: