LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, ARRAY SUBSTRATE, AND LIGHT-EMITTING DEVICE

WIPO Patent Application WO/2020/066780

A1

A light-emitting element mounting substrate (1) is provided with a base (10) and a raised part (20). The base (10) has a front surface (11) which is a major surface, and a back surface (12), the front surface (11) including a mounting part (11a) in which a light-emitting element (30) can be mounted. The raised part (20) is disposed at a peripheral part (11b) of the front surface (11) so as to surround the mounting part (11a). The front surface (11) is inclined at a predetermined angle (θ0) with respect to the back surface (12). The raised part (20) is provided with an opening part (25) in a portion of the peripheral part (11b) of the front surface (11) at which the thickness of the base (10) is reduced due to the inclination of the front surface (11). The portion of the raised part (20) at which the opening part (25) is provided is inclined in the same direction as the front surface (11) with respect to the back surface (12).

JPS6123346	ELECTRONIC COOLING LOW NOISE AMPLIFIER
JP3345529	[Title of the Invention] A wire bonding terminal and a method for manufacturing the same, and a method for manufacturing a semiconductor mounting substrate using the wire bonding terminal.
JP2000340702	SOLDER BALL TRANSFER SHEET AND MANUFACTURE THEREOF

HIGASHI TOSHIFUMI (JP)
FURUKUBO YOUJI (JP)
YAMAMOTO SENTAROU (JP)

PCT/JP2019/036516

April 02, 2020

September 18, 2019

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KYOCERA CORP (JP)

H01L23/12; H01L33/48; H01S5/022

WO2016171103A1	2016-10-27
WO2005054921A1	2005-06-16

JP2018088556A	2018-06-07
JP2000173085A	2000-06-23
JP2017135158A	2017-08-03
JP2006196505A	2006-07-27
JP2009277833A	2009-11-26

See also references of EP 3859912A4

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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