Title:
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/073220
Kind Code:
A1
Abstract:
In flip chip mounting in which a sealing resin is cured by a method of later supplying the sealing resin to a circuit substrate, this liquid epoxy resin composition for semiconductor sealing has excellent reliability and is not prone to result in voids remaining in cured sealing resin; also provided is a semiconductor device using said composition. This liquid epoxy resin composition for semiconductor sealing is used as the sealing resin supplied and thermally cured in gaps between the semiconductor device and circuit substrate which are connected, through conductive bumps, at pads formed on the semiconductor device and the circuit substrate, wherein this composition is characterized by containing an epoxy resin that is liquid at room temperature, an amine curing agent, a thermal-curing acrylic resin, a thermal polymerization initiator of the thermal-curing acrylic resin, and an inorganic filler.
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Inventors:
HASEGAWA TAKASHI
Application Number:
PCT/JP2013/050229
Publication Date:
May 15, 2014
Filing Date:
January 09, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
C08L63/00; H01L23/29; H01L23/31
Foreign References:
| JP2012116979A | 2012-06-21 |
Attorney, Agent or Firm:
NISHIZAWA TOSHIO (JP)
Toshio Nishizawa (JP)
Toshio Nishizawa (JP)
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