LITHOGRAPHIC CONTACT ELEMENTS

WIPO Patent Application WO2000033089

A3

A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

JP5191646	Manufacturing method of semiconductor integrated circuit equipment
JP3574565	ELECTRODE TERMINAL, PRESSING MEANS USED FOR CONTACT WITH IT AND ELECTRIC PART INSPECTION SOCKET USING THEM
JP2002148817	METHOD FOR PATTERNING RESIST, CONTACT PROBE WITH HIGH ASPECT RATIO AND METHOD FOR MANUFACTURING THE SAME

MATHIEU GAETAN L
ELDRIDGE BENJAMIN N
GRUBE GARY W

PCT/US1999/028597

March 08, 2001

December 01, 1999

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FORMFACTOR INC (US)

G01R1/073; G01B7/34; G01N27/00; G01R1/067; G01R3/00; H01L21/48; H01L21/60; H01L21/66; H01L23/48; H01R12/16; H01R33/76; H05K3/32; H05K3/40; (IPC1-7): G01R1/067; G01B7/34; G01N27/00; G01R3/00; H01L21/48; H01L23/48

WO1998052224A1	1998-11-19
WO1996037332A1	1996-11-28

US5828226A	1998-10-27
US5666190A	1997-09-09
US5606128A	1997-02-25
EP0413042A1	1991-02-20

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