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Title:
MEMBER FOR PLASMA PROCESSING DEVICE AND PLASMA PROCESSING DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2020/116384
Kind Code:
A1
Abstract:
Provided are: a member which is used for a plasma processing device and has an excellent plasma-resistance and improved adhesion strength to a substrate of a film; and a plasma processing device provided with the same. A member (1) for a plasma processing device is provided with: a substrate (2) containing a first element which is a metal element or a semi-metal element; a film (3) located on the substrate (2) and having, as a main component, an oxide, a fluoride, or an acid fluoride of a rare earth element; an amorphous part (4) which is interposed between the substrate (2) and the film (3) and contains at least one among the first element, yttrium, oxygen, and fluorine.

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WO/2021/065919MEMBER FOR PLASMA PROCESSING APPARATUSES AND PLASMA PROCESSING APPARATUS PROVIDED WITH SAME
Inventors:
ISHIKAWA KAZUHIRO (JP)
HINO TAKASHI (JP)
SAITO SHUICHI (JP)
Application Number:
PCT/JP2019/046997
Publication Date:
June 11, 2020
Filing Date:
December 02, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
TOSHIBA MATERIALS CO LTD (JP)
International Classes:
C23C14/08; C04B35/10; C04B41/87; H01L21/3065; H01L21/31
Domestic Patent References:
WO2019026818A12019-02-07
WO2019194248A12019-10-10
Foreign References:
JP2013095644A2013-05-20
KR20100131306A2010-12-15
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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